Programmable Logic Device PBGA484 Single-chip Microcomputer XC7A35T-2FGG484I

General Description
Xilinx® 7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor,
cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding
high-performance applications. The 7 series FPGAs include:
• Spartan®-7 Family: Optimized for low cost, lowest power, and high
I/O performance. Available in low-cost, very small form-factor
packaging for smallest PCB footprint.
• Artix®-7 Family: Optimized for low power applications requiring serial
transceivers and high DSP and logic throughput. Provides the lowest
total bill of materials cost for high-throughput, cost-sensitive
applications.
• Kintex®-7 Family: Optimized for best price-performance with a 2X
improvement compared to previous generation, enabling a new class
of FPGAs.
• Virtex®-7 Family: Optimized for highest system performance and
capacity with a 2X improvement in system performance. Highest
capability devices enabled by stacked silicon interconnect (SSI)
technology.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an
unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less
power than previous generation devices to offer a fully programmable alternative to ASSPs
Summary of 7 Series FPGA Features
• Advanced high-performance FPGA logic based on real 6-input look
up table (LUT) technology configurable as distributed memory.
• 36Kb dual-port block RAM with built-in FIFO logic for on-chip data
buffering.
• High-performance SelectIO™ technology with support for DDR3
interfaces up to 1,866 Mb/s.
• High-speed serial connectivity with built-in multi-gigabit transceivers
from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a
special low-power mode, optimized for chip-to-chip interfaces.
• A user configurable analog interface (XADC), incorporating dual
12-bit 1MSPS analog-to-digital converters with on-chip thermal and
supply sensors.
• DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder
for high-performance filtering, including optimized symmetric
coefficient filtering.
Table 1: 7 Series Families Comparison
Max. Capability
Logic Cells
Spartan-7
102K
Artix-7
215K
• Powerful clock management tiles (CMT), combining phase-locked
loop (PLL) and mixed-mode clock manager (MMCM) blocks for high
precision and low jitter.
• Quickly deploy embedded processing with MicroBlaze™ processor.
• Integrated block for PCI Express® (PCIe), for up to x8 Gen3
Endpoint and Root Port designs.
• Wide variety of configuration options, including support for
commodity memories, 256-bit AES encryption with HMAC/SHA-256
authentication, and built-in SEU detection and correction.
• Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip
chip packaging offering easy migration between family members in
the same package. All packages available in Pb-free and selected
packages in Pb option.
• Designed for high performance and lowest power with 28 nm,
HKMG, HPL process, 1.0V core voltage process technology and
0.9V core voltage option for even lower power.
Kintex-7
478K
Virtex-7
1,955K
Block RAM(1)
DSP Slices
DSP Performance(2)
MicroBlaze CPU(3)
Transceivers
Transceiver Speed
Serial Bandwidth
PCIe Interface
Memory Interface
I/O Pins
I/O Voltage
Package Options
Notes:
1.
4.2Mb
160
176 GMAC/s
260 DMIPs––––
800 Mb/s
400
1.2V–3.3V
Low-Cost, Wire-Bond
Additional memory available in the form of distributed RAM.
2.
13Mb
740
929 GMAC/s
303 DMIPs
16
6.6 Gb/s
211 Gb/s
x4 Gen2
1,066 Mb/s
500
1.2V–3.3V
Low-Cost, Wire-Bond,
Bare-Die Flip-Chip
Peak DSP performance numbers are based on symmetrical filter implementation.
3.
Peak MicroBlaze CPU performance numbers based on microcontroller preset.
34Mb
1,920
2,845 GMAC/s
438 DMIPs
32
12.5 Gb/s
800 Gb/s
x8 Gen2
1,866 Mb/s
500
1.2V–3.3V
Bare-Die Flip-Chip and High
Performance Flip-Chip
68Mb
3,600
5,335 GMAC/s
441 DMIPs
96
28.05 Gb/s
2,784 Gb/s
x8 Gen3
1,866 Mb/s
1,200
1.2V–3.3V
Highest Performance
Flip-Chip
© Copyright 2010–2020 Xilinx, Inc. Xilinx, the Xilinx logo, Alveo, Artix, Kintex, Spartan, UltraScale, Versal, Virtex, Vivado, Zynq, and other designated brands included herein
are trademarks of Xilinx in the United States and other countries. PCI, PCI Express, PCIe, and PCI-X are trademarks of PCI-SIG. All other trademarks are the property of their
respective owners.

Packaging and transportation instructions

- According to the standard export packaging.

Customers can choose from cartons, wooden cases and wooden pallets according to their own requirements.

Q&A

1. How to obtain the price?

We usually quote within 24 hours after receiving your inquiry (except weekends and holidays). If you are in urgent need of a price, please send us an email or contact us in any other way so that we can provide you with a quotation.

2. What is your delivery time?

This depends on the quantity of the order and the season in which you place the order. Usually, we can ship the goods within 7 to 15 days (for small batches), and for large batches, it takes about 30 days.

3. What are your payment terms?

Factory price, 30% deposit, 70%T/T payment before shipment.

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It can be transported by sea, air or express delivery (EMS, UPS, DHL, TNT, FEDEX, etc.). Please confirm with us before placing an order.

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